How to reduce thermal resistance of electronice contact surface

I have read some books about how to reduce thermal resistance of electronice contact surface. So there are many people a talk about this.

As we all know, most designers will position thermal interface materials in electronic assemblies by dispensing cure-in-place gap fillers as automotive electronics, telecom equipment, low-energy lighting, and other sectors demand higher production throughput, thinner bondlines, and reduced mechanical pressure on components and solder joints. As technology continues to advance, the trend toward designing smaller products with higher performance capabilities is requiring many to innovate and think of new ways of managing heat in more efficient ways. Proper thermal management is crucial to increasing or maintaining a product’s overall lifespan. This trend will drive changes in the characteristics and handling of thermal materials, as well as in the assembly processes and equipment used on the factory floor.
Thermally efficient pads and fillers have become vital in meeting demands to increase the performance and reduce the size of electronic assemblies, such as power supplies and control units, without compromising reliability. Today’s thermal materials are typically ceramic-filled silicone elastomers, which are easy to handle. They also conform well to the shape and surface texture of heatsinks or electronic components. And, they have high thermal conductivity relative to the still air they’re designed to eliminate.

Thermal Interface Effectiveness Measurement Configuration