How to reduce thermal resistance of electronice contact surface

I have read some books about how to reduce thermal resistance of electronice contact surface. So there are many people a talk about this.

As we all know, most designers will position thermal interface materials in electronic assemblies by dispensing cure-in-place gap fillers as automotive electronics, telecom equipment, low-energy lighting, and other sectors demand higher production throughput, thinner bondlines, and reduced mechanical pressure on components and solder joints. As technology continues to advance, the trend toward designing smaller products with higher performance capabilities is requiring many to innovate and think of new ways of managing heat in more efficient ways. Proper thermal management is crucial to increasing or maintaining a product’s overall lifespan. This trend will drive changes in the characteristics and handling of thermal materials, as well as in the assembly processes and equipment used on the factory floor.
Thermally efficient pads and fillers have become vital in meeting demands to increase the performance and reduce the size of electronic assemblies, such as power supplies and control units, without compromising reliability. Today’s thermal materials are typically ceramic-filled silicone elastomers, which are easy to handle. They also conform well to the shape and surface texture of heatsinks or electronic components. And, they have high thermal conductivity relative to the still air they’re designed to eliminate.

Thermal Interface Effectiveness Measurement Configuration

What about pre-formed thermal gap pads

Pre-formed thermal gap pads in standard or custom shapes, sizes, and thickness have at least one major attraction—they’re extremely easy to use compared to older material types such as thermal greases. The Greases are difficult to use and imprecise, so they aren’t desirable in the modern production environment. However, a growing need is emerging for thermal materials that can be formed in place.

As a further advantage of cure-in-place interface materials, any design changes that alter the position or types of components used can be accommodated quickly by changing the shape and volume of thermal material deposited. If automatic dispensing equipment  is used, it can be reprogrammed, avoiding any need to reorder gap-filler pads in different sizes or shapes.
AOK has successfully developed multiple types of non-corrosive, temperature-stable, thermally conductive dispensable gap filler solutions. These include two-part materials that are designed to be mixed together when dispensed and to wet out to the adjacent surfaces filling even the smallest air gaps and voids. AOK technical service staff can help engineers determine the appropriate materials for their application and heat transfer requirements.